EU releases final assessment report on important exemptions from RoHS
On January 13, 2022, the EU released the final assessment results of the nine exemptions from RoHS 6(a), 6(a)-I, 6(b), 6(b)-I, 6(b)-II, 6(c), 7(a), 7(c)-I and 7(c)-II. The assessment results show that some of the exemptions will not be extended and the scope of exemptions for some of the provisions will become more refined. The EU will subsequently issue a draft revision of RoHS based on the assessment results, and after the draft revision is adopted, the EU will issue a formal EU RoHS revision directive to amend the above exemptions. The final assessment results are summarized below.
Serial number | Exempt Uses | Exemption Deadline |
6(a) | Lead is used as an alloying element up to 0.35% (wt) in processed steel and up to 0.35% (wt) in galvanized steel. | -Class 8 in vitro diagnostic medical devices are valid until July 21, 2023 -Class 9 industrial monitoring equipment and Class 11 equipment is valid until July 21, 2024. |
6(a)-I | Lead is used as an alloying element and does not exceed 0.35% (wt) in the steel used for processing. | All categories are valid until July 21, 2024. |
6(a)-II | Lead, as an alloying element, is used in batch hot-dip galvanized steel containing no more than 0.2% (wt) lead. | All categories are valid until July 21, 2026. |
6(b) | Lead as an alloying element does not exceed 0.4% (wt) of lead in aluminum alloys. | -Class 8 in vitro diagnostic medical devices are valid until July 21, 2023 -Class 9 industrial monitoring equipment and Class 11 equipment is valid until July 21, 2024. |
6(b)-I | Lead is used as an alloying element with a lead content of no more than 0.4% (wt) in aluminum alloys, provided that the lead is derived from recycled aluminum scrap containing lead. | All categories expire 12 months after the decision is made. |
6(b)-II | Lead is used as an alloying element and does not exceed 0.4% (wt) of lead in aluminum used for processing. | All categories expire 18 months after the decision is made. |
6(b)-III | Lead is used as an alloying element in aluminum casting alloys with a content of no more than 0.3% (wt), provided that the lead is derived from recycled aluminum scrap containing lead. | All categories are valid until July 21, 2026. |
6(b)-IV | Lead is used as an element in aluminum alloys for processing, and the lead content does not exceed 0.4% (wt) in gas valves used in Class 1 electrical and electronic products (large household appliances). | Valid until December 31, 2024. |
6(c) | The lead content in the copper alloy does not exceed 4% (wt). | All categories are valid until July 21, 2026. |
7(a) | Lead in high melt temperature type solders (i.e.: lead in lead-based alloys ≥ 85%), except for lead exempted from the Section 24 exemption. Lead in high melt temperature type solder (i.e.: lead content ≥ 85% in lead-based alloys) when used in the following applications (excluding the Section 24 lead exemption): I) Internal interconnects used to connect chips or other components in semiconductor assemblies with steady state or transient/pulse currents greater than or equal to 0.1 A, or blocking voltages greater than 10 V, or chip edge dimensions greater than 0.3 mm x 0.3 mm; II) Integral (internal and external) connections for chip attachment in electrical and electronic components, if the thermal conductivity of the cured/sintered chip attachment material is > 35 W/(m*K), the conductivity of the cured/sintered chip attachment material is > 4.7 MS/m, and the solid phase wire melting temperature must be above 260°C; III) First-stage solder joints (internal or integral connections - meaning internal and external) for fabrication of components so that subsequent mounting of the electronic assembly to the sub-assembly (i.e. module or sub-circuit board or substrate or point-to-point soldering) using secondary solder does not cause reflow of the first stage solder. This item does not include chip connection applications and seals; IV) Secondary solder joints for connecting components to printed circuit boards or leadframes: 1. in solder balls used to connect ceramic ball grid arrays (BGA), 2. in high temperature plastic secondary molding (>220°C); V) as a sealing material between: 1. a ceramic housing or plug and a metal housing, 2. component termination and internal sub parts; VI) for electrical connections between reflector lamp elements in incandescent lamps for infrared heating lamps, high intensity discharge lamps or oven lamps; VII) for audio sensors with peak operating temperatures above 200°C. | All categories are valid through July 21, 2024, except for the Section 24 lead exemption. All categories are valid through July 21, 2026, except for the Section 24 lead exemption. |
7(c)-I | Lead in glass or ceramics (except capacitor-mediated ceramics) of electrical and electronic devices, or lead in glass or ceramic composites (e.g., piezoelectric ceramic devices). | All categories are valid until July 21, 2024. |
7(c)-II | Lead in dielectric ceramics of capacitors rated at 125V AC or 250V DC or above. | Not applicable to applications covered by Article 7(c)-I and 7(c)-IV of this Annex. All categories are valid until July 21, 2026. |
7(c)-V | Electrical and electronic components containing lead in glass or glass matrix compounds with 1) Protection and electrical insulation of high-voltage diode glass beads and wafer glass layers based on lead-zinc borate or lead borosilicate glass bodies,* 2) for sealing between ceramic, metal and/or glass parts. 3) bonding in a process parameter window of less than 500°C and a viscosity of 1013,3 dpa (the so-called "glass transition temperature"). 4) Used as resistive material such as ink, resistivity range from 1 Ohms/square to 1 Mega Ohms/square, excluding trimmer potentiometers**. 5) Chemically modified glass surfaces for microchannel plates (MCP), channel electron multipliers (CEM), and resistive glass products (RGP). | All categories are valid until July 21, 2026. |
7(c)-VI | Electrical and electronic components containing lead in ceramics with the following functions (excluding items covered by Articles 7(c)-II, 7(c)-III and 7(c)-IV of this Annex) 1) Piezoelectric lead-zirconium titanate (PZT) ceramics. 2) Ceramics with positive temperature coefficient (PTC) are provided. | All categories are valid until July 21, 2026. |
HCT Solutions:
After more than a year of evaluation, Oeko-Institut has finally released its final evaluation report for Pack 22. HCT would like to remind relevant companies to keep an eye on the latest developments of the above exemptions to ensure legal compliance of their products.
AboutHongCai Testing
Shenzhen Hongcai Testing Technology Co., Ltd (WALTEK HCT), is a member of Walter Testing Group. Founded in 2009, the company is headquartered in the eastern part of Shenzhen and is a comprehensive third-party organization with high visibility, influence and growth power in China.
At present, we have set up several offices and branches in Foshan, Dongguan and Huizhou. As a professional testing organization and certification consulting company, Hongcai Testing has the qualification of CNAS and CMA of China National Accreditation Service for Conformity Assessment, and has been accredited by CPSC and UL of USA, CSA of Canada, TUV, VDE of Germany, PSE-MARK of Japan, BSI, BABT of UK, C-TICK of Australia, NEMKO of Norway, DEMKO of Denmark, SEMKO of Sweden, FEMKO of Finland. Sweden SEMKO, Finland FIMKO, China CCC, the European Union market CE and international verification body CB and other international institutions recognized qualifications. The test report is recognized by many countries and regions around the world, with domestic and international credibility.
Over the years, with exquisite testing technology, advanced testing equipment and precise management concept, Hongcai always insists on the quality policy of "fair behavior, scientific method, accurate data and efficient service". We provide diversified, one-stop services and high-quality comprehensive solutions for customers, including program development, site survey, sampling, analysis, reporting, inspection, testing, certification and technical services, evaluation, technical consulting and training.